Hello,
How do you create a heat sink PAD that includes the top and bottom PCB areas and allows thru vias for improved heat conduction?
For example using the Apex PA340CC with 7 pin DDPAK surface mount package, or the TI BUF 634 DDPAK, or TI PowerPAD devices.
Any help is greatly appreciated.
Best,
Electron
7.1.14
OS X
10_13_6
EasyEDA
6.4.7