You need to use EasyEDA editor to create some projects before publishing
How to create a heat sink PAD for SMD
800 2
mawyatt 3 years ago
Hello, How do you create a heat sink PAD that includes the top and bottom PCB areas and allows thru vias for improved heat conduction? For example using the Apex PA340CC with 7 pin DDPAK surface mount package, or the TI BUF 634 DDPAK, or TI PowerPAD devices. Any help is greatly appreciated. Best,
Comments
andyfierman 3 years ago
Please see this topic and the document that it links to: [https://easyeda.com/forum/topic/How-to-avoid-DRC-errors-when-connecting-to-PCB-Footprints-a-k-a-PCB-Libs-90bf944fe3644b21a7d27a9e9d8df8d6](https://easyeda.com/forum/topic/How-to-avoid-DRC-errors-when-connecting-to-PCB-Footprints-a-k-a-PCB-Libs-90bf944fe3644b21a7d27a9e9d8df8d6)
Reply
mawyatt 3 years ago
@andyfierman Thank you. Best, Mike
Reply
Login or Register to add a comment
goToTop
你现在访问的是EasyEDA海外版,使用建立访问速度更快的国内版 https://lceda.cn(需要重新注册)
如果需要转移工程请在个人中心 - 工程 - 工程高级设置 - 下载工程,下载后在https://lceda.cn/editor 打开保存即可。
有问题联系QQ 3001956291 不再提醒
svg-battery svg-battery-wifi svg-books svg-more svg-paste svg-pencil svg-plant svg-ruler svg-share svg-user svg-logo-cn svg-double-arrow -mockplus- -mockplus- -mockplus- -mockplus- -mockplus- -mockplus- -mockplus- -mockplus-@1x -mockplus-

Cookie Notice

Our website uses essential cookies to help us ensure that it is working as expected, and uses optional analytics cookies to offer you a better browsing experience. To find out more, read our Cookie Notice