See: Spokes in: [https://docs.easyeda.com/en/PCB/Copper-Pour/index.html#Copper-Area-Attributes](https://docs.easyeda.com/en/PCB/Copper-Pour/index.html#Copper-Area-Attributes)<br> <br>

Beware that wider/shorter/no spokes increases the heat sinking to the rest of the copper around the joint and so makes it (much) harder to form a decent solder joint and makes reworking difficult without specialist hot air tools or desoldering metals

An example of a specialist desoldering alloy: [https://www.youtube.com/watch?v=UmD7F0--7Lc](https://www.youtube.com/watch?v=UmD7F0--7Lc)

@andyfierman Thanks man! Thats what I needed :) I am getting what you're saying but the small spokes wont be able to handle my big currents.

And I guss the color layer will prevent the solder to flow outsite from the pad... What do you think? 

@magie004, You are correct,  the blue area in your picture above is the solder mask. It's job is to stop solder flowing away from and bridging between pads. <br> <br> "...spokes wont be able to handle my big currents." What do you mean by "big"? Note that you can adjust the spoke dimensions in the right hand panel for Copper Area. If you are designing for high current then you need to look at trace width vs. current vs. temperature rise. Search the forum for "useful learning resources". You may also need to think about exposing the tracks to add a solder topping to them. Or using more layers or thicker (heavier) copper.