Hi,
In order to avoid ground loops, I would like to connect top and bottom layer GND copper areas at one single dedicated via only.
However, some of my footprints (e.g. cable connector headers) are multilayer and will make a thru-plated connection between top and bottom for any GND net pin.
What is the best way to avoid this, while still having thru-hole mounts for the headers?
BN
Electron
7.1.14
OS X
10_16_0
EasyEDA
6.4.19.3