I've been working on a project for the past few months that requires moderately intricate circuitry. The first PCB that I created and ordered didn't end up working, and I found that the culprit was that some of the vital ground pins weren't actually connected to ground. For this PCB, I laid out the traces for all the signal and VCC lines and then used a GND copper pour to connect all the GND pins together, as recommended by a guide I used. Looking back at my PCB design, I can clearly see areas where the copper pour was not connected to other grounded areas because the clearance values didn't let it go in between certain traces. I recently created a new PCB, and I noticed that when I put down a GND copper pour, the same issue occurred in certain sections. My board is only a two-layer board, and I don't have any major heat-producing components, and I was planning to put GND copper pours on both sides. I feel like in my case, it would be more helpful to just create GND traces instead of a GND copper layer. Is this idea correct? Or am I just doing something wrong? Thanks, Noah