I am wondering what method can I use to create a "ring" shape pad for a microphone with a bottom port. The obvious way is to use a through hole pad, without plating?, but this also adds a ring on the underside of the PCB, which I don't want. Also the solder area is up to the hole so this still risks the solder from covering the microphone hole. Here is a datasheet snippet from a TDK InvenSence T5818 mic showing the pad footprint. Here the inner ring diameter for the solder pad is 1.025 mm with the hole being less than 1mm in diameter. This makes better sense. But how can one do this as a footprint. Cannot figure this one out.