Hey. That might be in Copper area settings under Clearance. Check if changing the value helps.

The unfilled areas are to create what are referred to as Spokes or heat shunts. They form the thermal relief to stop the copper from sinking too much heat from the solder at the pads. You can turn them off by an attribute setting in the right hand panel when you select the copper area but that may cause soldering problems. Please look up Copper Area in the Tutorial.

@andyfierman Makes sense, thanks a lot!

Hi! This problem usually is solved by setting the copper area properties to match the IC packages used in your project.  Other / additional method is to add GND copper tracks to where you want them. If you want to set no pad thermals (Pad Connection: Direct). However, soldering to non thermal pad can be a bit trickier because they require more thermal energy to flow solder to the pad. In SMD reflow process this is not an issue anymore, though. Regards, Markus Virtanen HW / Electronics Designer