All modern Board editors have a PAD editing function. When wiring a Board, you always need to have different types of PAD on different layers of the Board.
In the current editor, it is not possible to make different PAD and VIA parameters on different Board layers.
For example: On the inner layers, the PAD should always be made smaller than on the soldering layer.
The editor doesn't allow you to create different platforms on different layers. Let's say I need a round pad on the top layer and a rectangular pad on the bottom layer.
In Altium and other systems, this is done elementary.
The PAD properties have the parameters multi-level, top layer, and bottom layer. You need to edit each parameter independently.
Brand new interactions and interfaces. 
Easy to use and quick to get started. 
"...On the inner layers, the PAD should always be made smaller than on the soldering layer."
That is not generally true except to reduce parasitic capacitance in high speed signal propagation.
For most applications there is little reason to assign different pad diameters on inner and outer layers.