All modern Board editors have a PAD editing function. When wiring a Board, you always need to have different types of PAD on different layers of the Board.
In the current editor, it is not possible to make different PAD and VIA parameters on different Board layers.
For example: On the inner layers, the PAD should always be made smaller than on the soldering layer.
Brand new interactions and interfaces. 
Easy to use and quick to get started. 
