<https://easyeda.com/Doc/Tutorial/creatingTheSchematic.html#h.h3xy6baqn04c> Please let me know after you try. Dillon.

Michal, Sorry this is a rather complicated answer but it is not quite clear from your question what are you asking. The possible questions that you *might be* asking are: i) how to add a package type to a symbol in a schematic; ii) how to add a new package to the device PCB footprint library; iii) do you want to surface mount the body of the device and bend the leads to surface mount them too; iv) do you want to surface mount the body of the device but have the leads bent to go through the PCB; v) is the device to be through hole with the body away from the surface of the PCB If you answer yes to (i) then Dillons post answers your queston. If you answer yes to (ii) then you need to read the rest of this post. The answers to (iii) - (v) matter because they change the PCB footprint that you will need. If you answer yes to (iii) then you can use D2PACKA footprint from the SparkFun Packages library because the D2PAK (TO263) is basically an I2PAK (TO262-3 pin) with the leads bent down: [http://www.irf.com/product-info/datasheets/data/irfz44zpbf.pdf] [http://www.onsemi.com/pub_link/Collateral/418AP.PDF] [http://www.onsemi.com/pub_link/Collateral/418AN.PDF] If you answer yes to (iv) then you can take the D2PACKA footprint from the SparkFun Packages library or the I2PAK footprint found by searching for it in: **Find Libraries ...** from the top toolbar and then modify it to remove the rectangular pads and replace them with 3 plated through holes of suitable plated diameters on a 2.54mm (0.1") pitch, some distance away from the package body **(never bend device leads close to the body: see figs, 5, 6 & 7 in: [http://www.infineon.com/dgdl/Processing_TO.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431936bc4b0119385051725a2e])** There is more information about creating PCB footprints here: [https://easyeda.com/Doc/Tutorial/creatingThePCBLibs.html] If you answer yes to (v) then you can use one of the TO220 package PCB footprints because the lead dimensions and pitch are similar. Does that answer you original question? [http://www.irf.com/product-info/datasheets/data/irfz44zpbf.pdf]: http://www.irf.com/product-info/datasheets/data/irfz44zpbf.pdf [http://www.onsemi.com/pub_link/Collateral/418AP.PDF]: http://www.onsemi.com/pub_link/Collateral/418AP.PDF [http://www.onsemi.com/pub_link/Collateral/418AN.PDF]: http://www.onsemi.com/pub_link/Collateral/418AN.PDF [http://www.infineon.com/dgdl/Processing_TO.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431936bc4b0119385051725a2e]: http://www.infineon.com/dgdl/Processing_TO.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431936bc4b0119385051725a2e [https://easyeda.com/Doc/Tutorial/creatingThePCBLibs.html]: https://easyeda.com/Doc/Tutorial/creatingThePCBLibs.html