I would like to ask if this is the right way of doing this kind of thing. What I want to achieve is to have option of using ACS712 or ACS770. There is NTPH in between pads with thermal vias on solder masked solid region Also is there better way of doing thermal vias? I used distribute array, but that requires making a lot of copies of via, selecting them, trying out the options and then removing them from holes that are already there.  Photoview is bugged for some reason when I added solder mask, but 3D view works. [https://easyeda.com/HansWegerzysten/npthquestion](https://easyeda.com/HansWegerzysten/npthquestion)