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Recommendation For Via on Exposed Pad
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ofdouglas 7 years ago
For many chips with an exposed pad, the IC manufacturer recommends to put vias on the exposed pad for best thermal performance. However, there is some concern about solder paste voiding (e.g solder is wicked into the via during reflow). Some possible solutions to this problem are to "tent" the via with solder mask, or to plug / fill the via during manufacturing. What approach does EasyEDA suggest for users of their PCB service?
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andyfierman 7 years ago
Please see: https://easyeda.com/forum/topic/How_to_include_thermal_vias_-Kr1ZljheA
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ofdouglas 7 years ago
I'm using KiCad for my design and have no trouble creating the via there; the question is about what options we have (and what results to expect) with the EasyEDA fabrication service. In your post you suggest that via-in-pad is not available with EasyEDA. What about a "tented" via, or a "mask plugged" via? KiCad creates tented vias by default, but I have read that the success of via tenting varies from process to process. In some cases the mask might not be viscous enough (probably not an issue with 0.3mm drill). In other cases there is a concern about contaminants being trapped inside the via.
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