Why would you want to remove the thermal reliefs for the caps? The ground connections on component pads are that way for a reason, without them, you would have to heat up all of the PCB GND for solder flow properly on the pad and component. You can change the pad connection type from Spoke to Direct in the copper area properties. That will remove those spots. 

The more usual name for the "Spokes" is "Heat Shunts" which gives you a bit more of a clue as to their purpose. The wider they are, the more heat they shunt away from the pad. :)