Hello!
I have a couple of fine-pitch smd ICs over which I have a concern with the output of the solder mask performed by EasyEDA. See images:
In EasyEDA:
![Viewed in EasyEDA layout editor][1]
[1]: /editor/20180208/5a7b3135dcae4.png
Gerber-viewer solder mask layer:
![no mask between pads?][2]
[2]: /editor/20180208/5a7b31872dcd4.png
Just looking for some reassurance here. The pitch for this IC isn't out of the ordinary (DFN-MF10), about 0.2mm between pads.
Thanks for any pointers.