Hello! I have a couple of fine-pitch smd ICs over which I have a concern with the output of the solder mask performed by EasyEDA. See images: In EasyEDA: ![Viewed in EasyEDA layout editor] : /editor/20180208/5a7b3135dcae4.png Gerber-viewer solder mask layer: ![no mask between pads?] : /editor/20180208/5a7b31872dcd4.png Just looking for some reassurance here. The pitch for this IC isn't out of the ordinary (DFN-MF10), about 0.2mm between pads. Thanks for any pointers.