Hello,
What is the difference in solid region when you set "solid" or "no solid"? also, as can I do a solid region in both faces with bores for higher dissipation?
Thanks
"What is the difference in solid region when you set "solid" or "no solid"?"
* Solid = the region defines a solid area of copper;
* No Solid = the region defines an area free of copper.
Solid can also be used to create:
1. solid regions of silk screen ink;
2. apertures in the solder and paste mask layers **but always check that you have the desired result in the Gerber output first** (using gerbv not the JLCPCB Viewer).
"...can I do a solid region in both faces with bores for higher dissipation?"
Please see:
[https://easyeda.com/forum/topic/How-to-place-multiple-vias-in-a-PCB-footprint-a34cf68d58414138898a56de60abd8c1](https://easyeda.com/forum/topic/How-to-place-multiple-vias-in-a-PCB-footprint-a34cf68d58414138898a56de60abd8c1)
[https://easyeda.com/forum/topic/How-to-avoid-DRC-errors-when-connecting-to-PCB-Footprints-a-k-a-PCB-Libs-90bf944fe3644b21a7d27a9e9d8df8d6](https://easyeda.com/forum/topic/How-to-avoid-DRC-errors-when-connecting-to-PCB-Footprints-a-k-a-PCB-Libs-90bf944fe3644b21a7d27a9e9d8df8d6)
Hello,
With the new version of EASYEDA I can not longer find the command to position the holes between two layers to increase thermal dissipation.
can someone kindly help me?
thanks in advanced
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