Where through-hole components connect to inner planes, it's usually desirable to use thermal relief pads. See, e.g., [Thermal relief](https://en.wikipedia.org/wiki/Thermal_relief). Whenever I've had to rework boards without thermal relief, I've found myself cursing the PCB designer, and don't want to have to curse myself. :-)
I have two questions:
1. What's the best way to accomplish this in EasyEDA as it is now?
2. Would you consider adding a feature to make this more straightforward?
Thanks,
Fred Wright
Brand new interactions and interfaces. 
Easy to use and quick to get started. 
