I'm trying to layout a high current switch.  I am using 2oz copper and have copper areas directly bonded to the Drain and Source of my MOSFET.  Unfortunately I have been having trouble getting good solder joints.  To increase my chances for the next attemp I am bending the legs to give myself more room to solder, and I created some gigantic pads so I can heat them up with a 130mil soldering iron tip. I also thought to heat both top and bottom it would be good to put some vias in the pad so the heat will transfer and I can get a good solder joint without shorting anything.  However I keep getting DRC clearance errors.  Of course the vias and the pads are on the same NET, but the error says they are not.  Any ideas?  Thanks -- Bob P.S.  When soldering (from the bottom) the MOSFET legs heat up first and solder runs through the holes down the legs and builds up on the bottom of the MOSFET until it bridges legs (all without sticking to the pads).  I have tried to mitigate this as well by reducing the size of the holes a bit and converting them to slots...