Sometimes it is necessary to make a PAD larger area from the soldering side. On the inner layers of the VIA and PAD, I want to do less than on the outer layer.
How do I make the PAD round on the top layer and square on the bottom layer?
Start with the shape and size that you want of the *smaller* pad.
Create that on **All Layers**.
Then create a single layer (top or bottom) pad with the same sized and centred hole in it as the all layers pad but make it the shape and size you want.
I did that.
I wanted you to modify the program.
When you change the parameters in the properties of the PAD or VIA, the parameter should only change in the selected layer. So done in altium. It will be very convenient.
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