* Please see **Understanding thermal relief or spokes around pads** in **PCB design notes** in (2.2) in (2) in: [https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a](https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a)<br> <br> * Note that adding vias into pads is not good practice as it can suck solder away from the joint by capillary action. For more on this, see: [https://easyeda.com/forum/topic/Via-inside-pad-9c8f0f0bf1c748f28a067b1052ea5603](https://easyeda.com/forum/topic/Via-inside-pad-9c8f0f0bf1c748f28a067b1052ea5603)

you can use solid region - no solid to cut out the copper after rebuild the copper area

@andyfierman Did you link to the wrong topic?

@lyseoy, No but I did forget to update the Table of Contents to show **Understanding thermal relief or spokes around pads** in **PCB design notes** in (2.2) in (2) in: [https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a](https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a)<br> <br> The note was there, it just wasn't listed in the ToC.

@andyfierman It still looks like the wrong topic to me... I see no mention of "thermal", "spoke", a TOC, or paragraph 2.2 in the topic you linked to.

Open: [https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a](https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a)<br> <br> Read it. Find: **(2) read [Welcome to EasyEDA](https://easyeda.com/andyfierman/Welcome_to_EasyEDA-31e1288f882e49e582699b8eb7fe9b1f) and the various nested documents that it links to;** Open: **[Welcome to EasyEDA](https://easyeda.com/andyfierman/Welcome_to_EasyEDA-31e1288f882e49e582699b8eb7fe9b1f)** Read it. Find: 2.2) [How to design PCBs](https://docs.google.com/document/d/1CU7RuPyFlSZPzWBN-YZ0x87xeAB4xpLdLaIsUwhLj_M/edit?usp=sharing)<br> <br> Open: [How to design PCBs](https://docs.google.com/document/d/1CU7RuPyFlSZPzWBN-YZ0x87xeAB4xpLdLaIsUwhLj_M/edit?usp=sharing)<br> <br> Read it. :)

Last steps: Find: **PCB design notes** Read it. Find: ****Understanding thermal relief or spokes around pads**.** Read it.

Hi lyseoy! This is part of clearance rules of your copper plane. You can adjust your clearance to adjust how those thermals behave. You can also adjust with direct pad entry instead of thermal reliefs. One note though that you need a bit more heat to solder a component to its pad if there is no thermal reliefs.  btw, placing ground vias inside the pad is not really advisable. Adding a couple ground vias in very near vicinity of the ground pad is always recommended. See picture below:  Regards, Markus Virtanen HW / Electronics Designer