For a TH component, laying a pad down puts a copper ring on the top and bottom layer. Can you set the layers on the pad so that there is no copper-ring on the top layer? I don't see the need for copper on the top and it makes it more difficult to de-solder the component if there is a mistake (student projects). Setting the solder mask layer to zero does not seem to help.
Chrome
71.0.3578.98
Windows
10
EasyEDA
5.8.22