All vias connect to all layers, so just track on the layer you want then end the track where you want the via then press the letter or number of the layer you want to change to.  The via will be automatically placed so then continue routing on the new layer. See the Tutorial for more information.

JLCPCB don't support partials and buried vias so presumably that's why their PCB tool doesn't.  You may need to use a more professional tool and a (far more expensive) PCB supplier if you really need these.

As Mike says, JLCPCB do not support blind and buried vias but the through hole vias are ok for up to 32 layers.

@andyfierman Thanks for reply. can you able to send the link of tutorial?

@MikeDB Thanks for reply. but sir I'm newly work in this field and i want to design 4 layer with buried and partials vias. How it is possible in this tool? please suggest....

@andyfierman The main purpose behind this is to reduce size of pcb that's why i want to know...

@jadhavmahendra51, With due respect, you have already been told that JLCPCB do not support blind and buried vias but the through hole vias are ok for up to 32 layers. * Therefore you cannot design a PCB using blind and buried vias using EasyEDA. Please read this: [https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a](https://easyeda.com/forum/topic/How-to-ask-for-help-and-get-an-answer-71b17a40d15442349eaecbfae083e46a)

To make it clearer: EasyEDA does not support blind and buried vias.

@jadhavmahendra51 " i want to design 4 layer with buried and partials vias. How it is possible in this tool? please suggest...." Quite easy - buy a licence for Cadstar and send the gerbers to a PCB house that does support buried vias.  And make sure your credit card can take the cost !

If you are only using 4 layers to try to make a high density PCB then you almost certainly will be using surface mount devices and will have a ground placne on one inner layer and power plane(s) on the other inner layer. Therefore, unless you are using BGA package, you will have little use for buried vias because most of them will be needed for top to bottom layer track connections. If you are using BGAs then you might benefit from blind vias to get to power and ground planes but then EasyEDA is not yet the tool to use for that type of advanced design.